Nitridation-induced degradation of SiC (1-100) MOS devices

Kobayashi, Takuma*; Nakanuma, Takato*; Suzuki, Asato*; Sometani, Mitsuru*; Okamoto, Mitsuo*; Yoshigoe, Akitaka; Shimura, Takayoshi*; Watanabe, Heiji*

no journal, , 

Together with a standard NO nitridation, a high channel mobility ( 100 cmVs) is obtained for SiC MOSFETs fabricated on non-basal planes, such as (1-100) m-face. Since these planes appear on the side wall of trench formed on (0001) Si-face, they can be directly applied to trench MOSFETs which have low on-resistance. Despite their advantages, the characteristics of MOS devices on non-basal planes, including the impact of nitridation, is not well investigated. In this work, we focused on SiC MOS devices on m-face and studied their physical and electrical characteristics in detail.